mBGA是什麼?

mBGA是不是一種記憶體的封裝技術?有人可以介紹一下嗎?

2 個解答

評分
  • 2 0 年前
    最佳解答

    有兩種可能的答案,至於何者才正確需要由前後文來判斷

    1.micro-BGA

    係一種封裝技術之名稱,根據美國專利第6655022號之專利說明書記載(可連結到http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PT...

    Another type of integrated circuit package is the micro ball grid array.TM. (.mu.BGA.TM.) package. .mu.BGA is a registered trademark of Tessera, Inc. of San Jose, Calif. The .mu.BGA package enables IC manufactures to respond to customer needs for smaller and thinner components. The .mu.BGA package is considered a chip size package (CSP). A chip size package is generally defined as a package which does not exceed the die size by greater than 20%.

    亦可以到Tessera公司的網頁去瀏覽關於micro-BGA之訊息‧

    http://www.tessera.com/technologies/products/bga_c...

    2.Metal BGA

    Metal BGA係指BGA封裝製程中,係以由金屬材料製成之基板承載半導體晶片‧

  • 峻聿
    Lv 4
    2 0 年前

    是晶片封裝技術

    不只有記憶體晶片能用

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