翻的英文句子好像段落有點不對,能幫忙修飾一下嗎

The surface sticks to the technique(the Surface Mount Technology, SMT) The surface sticks to technique's ising the packing method that loads the electronics component to machine with the chip, and is former with the dissimilarity Weld the way to assemble on the circuit board, change the traditional boring plug-in... 顯示更多 The surface sticks to the technique(the Surface Mount Technology, SMT)
The surface sticks to technique's ising the packing method that loads the electronics component to machine with the chip, and is former with the dissimilarity
Weld the way to assemble on the circuit board, change the traditional boring plug-in method as the fast surface meanwhile
Stick to the way, this kind of is sticky the chip piece to way with the surface, settling the technique in PC board,
Knowing together as the surface sticks to the technique.
Use the surface sticky the technique advantage is a lot of, for example promote the function density, the weight eases, reducing to give or get an electric shock the feeling electric capacity with
The resistance reduces the production cost, matching the target of"light,thin,short and small"s that the electronics industry pursues.
The SMT is the machine that produces the electronics product, he follow former?The biggest dissimilarity in machine that the piece produces' lying in it can raise the speed and quality, on the good rate also low in 5 ppms(bad rate),
The surface is a spare parts immediately after(the Surface Mount Device, SMD)
The SMD shrinks traditional electronics spare parts spare parts after turning, the reason that the electronics spare parts' canning shrink the words is because of(這裡怪怪的,後面接著The,T是大寫嗎?)
The wafer equipment can produce the smaller spare parts(the electronics breaks the ability rank and does not need the larger energy, so consume to give or get an electric shock the quantity
Less), and SMD another advantage lets the electronics product made more more small, the production speed is sooner.
還有其他什麼地方該改一下?能用紅色字體改出來看看嗎?謝謝~
更新: 表面黏著技術(Surface Mount Technology ,SMT)
表面黏著技術是將電子元件以晶片裝載器的包裝方式,並以不同以往的
焊接方式來組裝在電路板上,同時將傳統穿孔插件方式改為快速的表面
黏著方式,這種將晶片件以表面黏著方式,安置在印刷電路板的技術,
統稱為表面黏著技術。
使用表面黏著技術優點很多,例如提升功能密度,重量減輕,減少電感電容和
阻抗降低生產成本,符合電子產業所追求的「輕、薄、短、小」的目標。
SMT就是生產電子產品的機器,他跟以往的揷件生產的機器最大不同在於能提高速度與品質,在良率上也低於5ppm(不良率),
更新 2: 表面接著零件(Surface Mount Device,SMD)
SMD是將傳統的電子零件縮小化後的零件,電子零件之所以可以縮小話是因為
晶圓設備可以產生出更小的零件(電子突破能階不需要更大的能量,所以耗電量
更少),而SMD的另一個好處就是可以讓電子產品越作越小,生產速度更快。
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