N25 發問時間： 社會與文化語言 · 1 0 年前

英文專業翻譯-關於sensor-英翻中

6.1. Measurement of heat-flux partitioning

To measure what ratio of the heat is leaving the package via the cooling mount and what ratio is moving towards the board this new thin heat-flow sensor may be used advantageously. Let us examine as an example the arrangement of Fig. 9. An IC is soldered into the printed wiring board. The top surface of the package is equipped with a cooling mount. We wish to measure what percentage of the dissipated power leaves the package via the cooling mount and what is the percentage that passes through the PWB. Inserting the heat-flux sensor into the indicated interface the power leaving upwards can be easily measured. It is supposed that the rest of the power is leaving via the PWB.

1 個解答

• Angel
Lv 4
1 0 年前
最佳解答

6.1.熱流分隔的測量

要測量 熱的比率正經由冷卻的底板離開 和 比率正朝板子移動 ，這個新的微弱熱流感應器可能會被有助益地使用．

2006-05-05 19:27:46 補充：

＜修正＞：6.1.熱流分隔的測量測量熱的比率經由冷卻的底板離開此包(一組事物)以及比率正朝板子移動 ，這個新的微弱熱流感應器可能會被有助益地使用．讓我們檢查像圖９排列的一個例子．一個 IC 被焊入印好的線路板．此包的最高表面裝備著一個冷卻的底板．我們想要測量消散電力(功率)的百分率經由冷卻的底板離開此包以及經由PWB(功率瓦特級)通過的百分率是多少．熱流感應器嵌入被指示電力朝上離開的接口可以輕易地被測量．假設電力的停止正經由PWB離開．

參考資料： 自己